Release to manufacturing (RTM) has two meanings. In software, it is the final build of a version, handed over for duplication and distribution. In hardware, it is the frozen design package that a plant or contract manufacturer builds the product from.
Both share one idea: freeze one version, sign it off and hand it to the people who make the copies. After that, it changes only through a formal process. This glossary covers the terms around each meaning, plus the release package for a printed circuit board (PCB) assembly.
Software release terms
Release candidate (RC)
A release candidate is a build that is ready to ship unless significant bugs show up.1 Its features are complete and no showstopper bugs are known. If testing finds one, the team builds the next candidate. This stage is also called “going silver”.1
Release to manufacturing (RTM)
RTM is the point at which a software version is final and ready to be delivered.1 The signed-off build goes to whoever makes the copies, whether a disc replication plant or a download server. After RTM, fixes ship as patches or new versions.
Going gold
“Going gold” is another name for reaching RTM.1 The final build is called the gold master, and it goes to mass duplication. The name comes from mastering in the audio record-making industry.1
General availability (GA)
General availability is the stage at which the product can be bought, because all commercialization work is done. That work includes security and compliance tests, localization and worldwide availability. Even then, availability can depend on language, region, and download versus physical media.1
RTM vs GA
RTM is the day the build is final. GA is the day customers can buy and use it. The gap runs from days to months while the commercialization work is finished.1 Put simply, RTM is an engineering milestone and GA is a commercial one.
Go-live in a running plant
Neither RTM nor GA decides when a new version reaches your shop floor. Putting a vendor update or an in-house tool into a running plant is a release of its own. It follows a release checklist with a rollback path and a smoke test, which our production release process page sets out for small manufacturing software and AI teams.
Hardware build gates: EVT, DVT and PVT
Hardware teams commonly reach a release through three build-and-test gates: the engineering, design and production validation tests (EVT, DVT and PVT).2 What follows is common usage, not a standard. Each company defines its own gates and their order, and some merge, skip or rename them.
EVT: engineering validation test
Early prototypes answer one question: does the engineering concept work? The build checks core functions, key components and technical feasibility.2 An Instrumental guide gives its purpose as finding all the issues the design needs fixed.3
DVT: design validation test
DVT asks whether the complete design meets its requirements: performance, durability and function together.2 Contract electronics manufacturer BELI Technologies sets the DVT exit where the product meets its full spec and certification samples are submitted.4
PVT: production validation test
PVT asks whether the approved design can be produced reliably.2 The Instrumental guide puts its purpose as verifying mass-production yields at mass-production speeds.3 Where the formal release sits is a company decision. Some release the design when DVT ends, so PVT builds from released documents. Others wait until PVT has proven the yields.
Names and order vary
The Instrumental guide notes that a few companies use slightly different nomenclature, and its own sequence adds a proto build before EVT and a ramp after PVT.3 Wikipedia expands EVT as engineering verification test.5 BELI calls merging EVT and DVT reasonable for a simple board derived from a proven reference design, and lists skipping DVT as a common failure mode.4
The hardware release package for a PCB assembly
The release package is the set of files a plant or contract manufacturer builds from. A contract manufacturer needs a file package even before the first EVT build;4 the release package is its final, frozen form. Every file in it must represent the same design revision,6 and after release it changes only through an engineering change order (ECO).
The first five rows follow the file list that PCB assembler Screaming Circuits asks for;6 the other four cover test, firmware, packing and records.
| Item | What it contains | Why production needs it |
|---|---|---|
| Bill of materials (BOM) | Internal part number, manufacturer part number (MPN), description, quantity and reference designators per line; approved alternates in their own columns; do-not-place (DNP) parts marked | Purchasing orders from it and kitting picks from it. MPNs, not distributor numbers, keep sourcing flexible.6 |
| Board data | Gerber files for every layer plus a drill file, or one ODB++ or IPC-2581 data set | The board maker builds the bare board from it; the assembler makes stencils from it. |
| Fabrication notes | Board thickness, copper weight, surface finish, controlled-impedance requirements, layer stack-up | These properties do not show in the layer images. |
| Pick-and-place (centroid) file | Reference designator, X and Y position, rotation and board side for each part, with units and origin | It programs the placement machines. Screaming Circuits needs it only when Gerber is sent instead of ODB++ or IPC-2581.6 |
| Assembly drawing | Component orientation, polarized parts, DNP locations, special assembly steps | Operators and inspectors check each board against it. |
| Test specification | Tests to run, pass and fail limits, test program and fixture revisions | Test can pass or reject a board without calling engineering. |
| Programming files | Firmware image with its own part number, version, checksum and loading steps | Each board gets the firmware the design was validated with. |
| Packaging and labels | Electrostatic discharge (ESD) packaging, label content (part number, revision, serial or date code), units per box | Every box is packed the same way, and each unit is traceable. |
| Release record | Revision letter, ECOs included, release date, approvers, and a read-me for anything the files do not show | Anyone can check which revision they are building and why it changed. |
For the fields behind each BOM line, see Electronic Parts Data Management for Small EMS and OEM Teams.
Change control after release: ECR, ECO and ECN
After release, nobody edits the package directly. A change passes through three documents.
Engineering change request (ECR)
An ECR proposes a change and gives the reason for it. A change review board weighs its technical and business justification and plans it as a minor or major change.7 A rejected request stops here.
Engineering change order (ECO)
An ECO is the approved document that authorizes a change to the product and its documents.8 It names the affected parts and drawings, the reason, and the documents and departments involved. It also says when the change takes effect: immediately (scrapping current stock), at the next production run, or at another milestone.8
Engineering change notice (ECN)
An ECN is the official notice that a change has been approved. Many companies send a formal ECN to contract manufacturers and other partners so they build the product correctly.9 The names overlap, though: some companies call the change order itself an ECN.8
A different release: production orders in an ERP
In an enterprise resource planning (ERP) system, “release” is a planning step for a single production order, not a design hand-off. In SAP S/4HANA, releasing an order changes its status from created to released. Only then can the plant print order papers and post goods issues, confirmations and goods receipts.10 In PeopleSoft Manufacturing, released production is sent to the shop floor and is available to start.11
FAQ
Do cloud and web products still have an RTM?
Often not as a separate step: Google Cloud moves products from Preview to General Availability, which it defines as open to all customers and ready for production use.12 The term lives on in build names. Microsoft marks a SQL Server build “RTM” when no service packs or hotfixes have been applied.13
Is a design freeze the same as a release?
No: a freeze stops changes to part of the design, often gate by gate. In BELI’s gate table, the schematic is frozen at EVT exit, and the BOM and mechanical design at DVT exit.4 The release comes when the whole package is signed off and handed to production.
Who should sign off a hardware release?
The people who carry the cost of a bad release: the design owner, quality and manufacturing engineering, with purchasing reviewing the BOM. If a contract manufacturer builds the board, ask it to confirm in writing which revision it will build. Record names in the release record, not just roles.
What if PVT finds a design problem?
Treat it as a change, not a line fix: raise an ECR, approve an ECO and issue a new revision. BELI warns that every part swap after DVT invalidates some validation data and can trigger re-quoting, new fixtures or even re-certification.4 Weigh that cost before approving.
How do you stop purchasing from buying parts for an old revision?
Purchasing usually orders from the ERP, so compare the ERP’s BOM with the released one before every build. A line-by-line comparison shows added, removed and changed parts; How to Compare Two BOM Revisions in Excel walks through the method. Put your contract manufacturer on every ECN as well.
Footnotes
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Wikipedia, “Software release life cycle”, accessed 2026. https://en.wikipedia.org/wiki/Software_release_life_cycle ↩ ↩2 ↩3 ↩4 ↩5 ↩6 ↩7
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OpenBOM (Jared Haw), “EVT vs. DVT vs. PVT – Understanding the Stages of Product Development”, 2023. https://www.openbom.com/blog/evt-vs-dvt-vs-pvt-understanding-the-stages-of-product-development ↩ ↩2 ↩3 ↩4
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Instrumental (Anna-Katrina Shedletsky), “Hardware engineers speak in code: EVT, DVT, PVT decoded”, 2016, updated 2024. https://instrumental.com/resources/optimize-manufacturing-processes/hardware-engineers-speak-in-code-evt-dvt-pvt-decoded/ ↩ ↩2 ↩3
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BELI Technologies, “EVT, DVT, PVT: Hardware Build Stages and Your EMS”, 2026. https://belitechnologies.com/blog/evt-dvt-pvt-hardware-build-stages ↩ ↩2 ↩3 ↩4 ↩5
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Wikipedia, “Engineering validation test”, accessed 2026. https://en.wikipedia.org/wiki/Engineering_validation_test ↩
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Screaming Circuits, “PCB Design File Requirements for Assembly: What You Need to Submit for a Successful Build”, 2026. https://www.screamingcircuits.com/blog/pcb-design-file-requirements-for-assembly-what-you-need-to-submit-for-a-successful-build ↩ ↩2 ↩3 ↩4
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PTC, “What is Engineering Change Management?”, accessed 2026. https://www.ptc.com/en/technologies/plm/engineering-change-management ↩
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Wikipedia, “Engineering change order”, accessed 2026. https://en.wikipedia.org/wiki/Engineering_change_order ↩ ↩2 ↩3
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Arena, “Engineering Change Notice (ECN) Definition”, 2026. https://www.arenasolutions.com/resources/glossary/engineering-change-notice/ ↩
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SAP Learning, “Releasing Production Orders” (course: Manage Production Orders in SAP S/4HANA Manufacturing), accessed 2026. https://learning.sap.com/courses/manage-production-orders-in-sap-s-4hana-manufacturing/releasing-production-orders ↩
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Oracle, “Understanding Releasing Production and Changing Production Statuses”, PeopleSoft Manufacturing documentation, accessed 2026. https://docs.oracle.com/cd/F96358_01/fscm92pbr51/eng/fscm/smfg/UnderstandingReleasingProductionandChangingProductionStatuses-9f2cbc.html ↩
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Google Cloud, “Google Cloud products: product launch stages”, accessed 2026. https://cloud.google.com/products#product-launch-stages ↩
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Microsoft Learn, “Frequently asked questions, used terms and acronyms - SQL Server”, 2023. https://learn.microsoft.com/en-us/troubleshoot/sql/releases/faq-acronyms ↩


